Method for crimping a stone
US10743625B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Sep 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG04B47/042
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for assembling a stone on a setting support, the stone being cut to exhibit a table, a crown, a girdle and a pavilion. A substrate with a recess for the stone, the recess forming, between the substrate and the stone, a peripheral free space in the vicinity of the girdle and of the zones of the crown and of the pavilion contiguous to the girdle, the peripheral free space including a bottom having a conductive surface. Electroplating, in the peripheral free space, a metal layer in the vicinity of the girdle and of the zones of the crown and of the pavilion contiguous to the girdle, so as to confine the girdle in the metal layer to form, around the girdle, the setting support. The stone and its setting support are released from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.