Method for processing a workpiece
US10744594B2 · kind B2 · utility
0Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 22, 2016 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Dec 22, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45104
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a method for processing a workpiece (2) using a tool (9), in particular for repairing a surface (4) using a laser, the tool (9) being piloted by a control element (10), the tool (9) is to be controlled via a position of the control element (10) and a pressure which is applied either to the control element (10) or by the control element (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.