Electronic apparatuses and methods for manufacturing an electronic apparatus
US10744737B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | May 31, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure proposes a method for manufacturing an electronic apparatus and a corresponding electronic apparatus. The method comprises: removing a back film in a first region of a flexible substrate; and bending the flexible substrate in the first region to form an electronic apparatus having a bending portion. The electronic apparatus comprises: a flexible substrate having a bending portion in a first region thereof; and a back film bonded to a region of a back surface of the flexible substrate except for the first region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.