Ambient-light-sensing hole structure package and method of manufacturing the same

US10746595B2 · kind B2 · utility

Assignees

• Interface Technology (ChengDu) Co., Ltd. · CN
• Interface Optoelectronics (ShenZhen) Co., Ltd. · CN
• General Interface Solution Limited · TW

Inventors

• Chun-Hung Chen · Taipei, TW
• Jing Yu · Xiamen, CN
• Tai-Wu Lin · Tangxia, CN
• Yen-Chang Yao · Tangxia, CN
• Ya-Ting Chang · Taoyuan, TW
• Pang-Chiang Chia · Baoshan, TW
• Yen-Heng Huang · Tangxia, CN

Key dates

• Filing date: May 7, 2018
• Grant date: Aug 18, 2020
• Expiry date: Aug 22, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J1/0455
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.