Cooling and heating structure for fiber optic transceiver
US10746948B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2019 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Sep 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02438
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A cooling and heating structure for a fiber optic transceiver is disclosed. In the cooling and heating structure, a field programmable gate array (FPGA) chip reads a temperature value of a small form-factor pluggable transceiver (SFP) cage from a sensor, a digital to analog converter (DAC) converts the temperature value into a voltage value, a processing chip converts the voltage value into an output-voltage value, and a thermoelectric cooler (TEC) adjusts a working wattage thereof according to the output-voltage value, so as to control the TEC to cool or heat the SFP cage, thereby achieving the technical effect of using the TEC to cool and heat the SFP cage to prevent link down and instability of the fiber optic transceiver during signal transmission in the high-temperature environment and the low-temperature environment from occurring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.