Laptop computer with integral cooling
US10747277B2 · kind B2 · utility
5Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Dec 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.