Coil module including a upper coil, a lower coil, a lower outer pattern outside the lower coil, and a local area communications coil outside the lower coil
US10748048B2 · kind B2 · utility
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20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 18, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Oct 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B5/266
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A coil module includes a substrate; an upper coil disposed on at least one surface of the substrate in an upper portion of the substrate; a lower coil disposed on at least one surface of the substrate in a lower portion of the substrate; and a lower outer pattern disposed on an outer side of the lower coil in the lower portion of the substrate and connected to either one or both of the upper coil and the lower coil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.