Metal smart card with dual interface capability
US10748049B2 · kind B2 · utility
2Cited by
6References
46Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07773
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A smart card having a metal layer, an opening in the metal layer and a dual interface integrated circuit (IC) module and a plug non-RF-impeding material mounted in the opening, with at least one at least one additional layer stacked relative to the plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.