Integrated mechanical device with vertical movement
US10748726B2 · kind B2 · utility
0Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Dec 17, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/053
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A device includes a thermally deformable assembly accommodated in a cavity of the interconnection part of an integrated circuit. The assembly can bend when there is a variation in temperature, so that its free end zone is displaced vertically. The assembly can be formed in the back end of line of the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.