System and method for monitoring treatment of microelectronic substrates with fluid sprays such as cryogenic fluid sprays
US10748788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Jul 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for treating a substrate is described. In particular, the system and method for treating a substrate include techniques for removing particles from the surface of a microelectronic substrate. The system includes: a vacuum process chamber; a substrate stage for supporting a microelectronic substrate within the vacuum process chamber; a cryogenic fluid supply system that can provide a fluid or fluid mixture through one or more nozzles arranged within the vacuum process chamber to inject a fluid spray into the process chamber in a direction towards an upper surface of the microelectronic substrate; and a process monitoring system coupled to the vacuum process chamber, and arranged to collect fluid spray data corresponding to at least one measured attribute of the injected fluid spray downstream of an exit of the one or more nozzles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.