Package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure
US10748839B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 20, 2019 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Nov 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.