Patent · US Active

Production of sensors

US10749055B2 · kind B2 · utility

1Cited by

1References

20Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Dirk Becker · Bad Hersfeld, DE
Matthias Sperl · Mintraching, DE

Key dates

Filing date	Oct 5, 2017
Grant date	Aug 18, 2020
Priority date	—
Expiry date	Oct 5, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.