Optoelectronic component and method of producing an optoelectronic component
US10749084B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 7, 2017 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Apr 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.