Light emitting device package including a recess provided under a light emitting device and having a closed loop shape
US10749089B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2018 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Aug 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/83
Abstract
A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.