Piezoelectric vibration component and method for manufacturing the same
US10749492B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Aug 18, 2020 |
| Priority date | — |
| Expiry date | Sep 1, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/022
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A lid and an insulating bonding layer that seal a piezoelectric vibrator on a substrate are bonded with higher strength. A piezoelectric vibration component includes a substrate having a principal surface on which a piezoelectric vibrator is mounted, an insulating film disposed on the principal surface, a lid having a recess opening toward the principal surface and an edge portion around the recess. Moreover, first and second insulating bonding layers are interposed between the lid and the substrate. The first and second insulating bonding layers are joined together between the edge portion and the insulating film so as to seal the piezoelectric vibrator in a space between the recess and the principal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.