Method of inserting a surgical implant within a transcorporeal void
US10751192B1 · kind B1 · utility
7Cited by
2References
3Claims
0Family size
Inventors
Key dates
| Filing date | Jul 17, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2002/3092
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implant preshaped before placement anteriorly between a superior endplate and an inferior endplate within a void created by a transcorporeal procedure in a vertebra, the implant having no circular cross-sectional dimension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.