Printing device, thermal print head structure and method for manufacturing the thermal print head structure
US10752014B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/3359
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head structure includes a fixed electrode layer, a movable electrode layer opposite to the fixed electrode layer, a protection layer group covering the fixed electrode layer and the movable electrode layer, a heat source used to heat the fixed electrode layer, and a number of spacers. The fixed electrode layer includes a fixed electrode line. The movable electrode layer includes a flexible electrode line which is intersected with the fixed electrode line. These spacers are located between the fixed electrode layer and the protection layer group such that gaps are defined between the fixed electrode layer and the protection layer group. When a potential difference is generated between the fixed electrode line and the flexible electrode line, the movable electrode layer contacts the fixed electrode layer through the gap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.