Method of feeding electronic components and electronic component feeder
US10752391B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Dec 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/028
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for feeding electronic components are capable of increasing a rate of filling accommodation holes with electronic components. An accommodation plate including accommodation holes, respective openings of which are distributed over a main surface of the accommodation plate, is prepared, and electronic components are loaded onto the main surface of the accommodation plate. A horizontal vibration in an X-axis direction and/or a Y-axis direction and a vertical vibration in a Z-axis direction are applied to the accommodation plate with the main surface of the accommodation plate level. The horizontal and vertical vibrations have an equal number of vibrations and a prescribed phase difference therebetween. The accommodation plate is vibrated so that each of the electronic components is fed into one of the accommodation holes while moving over the main surface of the accommodation plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.