Photocurable resin composition and method of forming patterns using the same
US10752718B2 · kind B2 · utility
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5References
4Claims
0Family size
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Key dates
| Filing date | Oct 5, 2016 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Nov 3, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2004
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a photocurable resin composition usable in a nanoimprint process which is capable of overcoming low productivity of conventional semiconductor processes for optical devices and electronic devices, and a method of forming patterns using the same. Specifically, the present invention relates to a photocurable resin composition including a specific perfluorinated acrylic compound for improving release property between a nanoimprint mold and the photocurable resin composition, and a method of forming patterns using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.