Heat-resistant resin and method of preparing the same
US10752754B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2015 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jul 8, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/011
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a heat-resistant resin and a method of preparing the same. More particularly, the present invention relates to a heat-resistant resin including 100 parts by weight of a styrene based resin and 0.5 to 5 parts by weight of silica having a contact angle of 10 to 60° and an average particle diameter of 0.1 nm or more and 100 nm or less, a method of preparing the same and a heat-resistant resin composition including the same. In accordance with the present invention, provided are a heat-resistant resin having a low moisture content and a small content of fine particles while having heat resistance equal to or higher than conventional resins and, accordingly superior cohesion, a method of preparing the same, and a heat-resistant resin composition including the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.