Reaction-curable adhesive, adhesive kit, and method of using reaction-curable adhesive
US10752816B2 · kind B2 · utility
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8References
5Claims
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Key dates
| Filing date | Jan 23, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Mar 17, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2479/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.