Microspring probe card with insulation block
US10753959B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jan 29, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2635
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.