Methods and apparatuses for assessing high temperature bonding systems and bonded substrates therefrom
US10755000B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 6, 2016 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jun 27, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.