Multilayer ceramic electronic component
US10755856B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2018 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The ceramic body further includes a protective layer including a protective layer dummy electrode disposed on at least one of upper and lower portions of the first and second internal electrodes, and the protective layer dummy electrode has a thickness ranging from greater than to 1.2 times or less a thickness of each of the first and second internal electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.