Multilayer ceramic electronic component
US10755860B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Feb 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component includes: a ceramic body having a dielectric layer, and a plurality of first and second internal electrodes facing each other with the dielectric layer interposed therebetween; and first and second external electrodes disposed on an outer surface of the ceramic body, respectively. The ceramic body includes an active portion including a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween to form capacitance, and cover portions formed on upper and lower portions of the active portion. A buffer region is disposed between at least one pair of first and second internal electrodes among the plurality of first and second internal electrodes disposed inside the active portion, and satisfies the relation 0<tb<150 μm+td, where td is a thickness of the dielectric layer, and tb is a thickness of the buffer region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.