Transfer method, mounting method, transfer device, and mounting device
US10755958B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 26, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Mar 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A transfer method for transferring LED chips, a first surface of which is held on a transfer substrate, on a transfer-target substrate is provided that comprises disposing the transfer-target substrate such that the transfer-target substrate faces, across a gap, a second surface of the LED chips on an opposite side from the first surface of the LED chips, and transferring the LED chips on the transfer-target substrate by irradiating the transfer substrate with a laser light to separate the LED chips from the transfer substrate and by urging the LED chips toward the transfer-target substrate. At least the transferring of the LED chips to the transfer-target substrate being executed in a vacuum environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.