Method of fabricating implantable medical devices from a polymer coupon that is bonded to a rigid substrate
US10756043B2 · kind B2 · utility
0Cited by
7References
13Claims
0Family size
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Key dates
| Filing date | Jul 7, 2017 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jul 7, 2037 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B5/24
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Plural medical device formed from one or more layers of thin film polymer are assembled from a single polymer coupon. Initially the coupon is bonded to a rigid substrate. Force, heat and a suction are selectively applied to the coupon to ensure that it has a consistent height across its exposed surface. Once the polymer coupon is bonded the components forming the medical device are attached to the coupon and the coupon is shaped to form the individual medical devices. Shaped sections of the coupon are then lifted off the rigid backing. The lifted off sections on which the components were attached are the medical devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.