Substrate and method of fabricating the same, display panel, and display device

US10756151B2 · kind B2 · utility

Assignees

• BOE Technology Group Co., Ltd. · CN
• HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD. · CN

Inventors

• Wenbin Jia · Beijing, CN
• Huifeng Wang · Beijing, CN
• Chinlung Liao · Beijing, CN
• Feifei Zhu · Beijing, CN
• Xiang Wan · Beijing, CN

Key dates

• Filing date: Oct 1, 2018
• Grant date: Aug 25, 2020
• Expiry date: Jan 5, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/1201

Abstract

A method of fabricating a substrate includes forming a planarization layer, and forming the planarization layer includes: forming a first planarization sub-layer on a base substrate on which a patterned film layer has been formed. A surface of the first planarization sub-layer facing away from the base substrate has a plurality of depressed portions. Forming the planarization layer further includes: forming a second planarization sub-layer at multiple depressed portions of the plurality of the depressed portions to obtain the planarization layer including the first planarization sub-layer and the second planarization sub-layer. A flatness of a surface of the planarization layer is higher than a flatness of the surface of the first planarization sub-layer.