Integrated module of acoustic wave device with active thermal compensation and an active thermal compensating method thereof
US10756625B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Jan 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M3/155
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An integrated module of acoustic wave device with active thermal compensation comprises a substrate, an acoustic wave filter, an active adjustment circuit and at least one variable capacitance device. The acoustic wave filter comprises a plurality of series acoustic wave resonators formed on the substrate, at least one shunt acoustic wave resonator formed on the substrate and a thermal sensing acoustic wave resonator. Each of the variable capacitance device is connected in parallel to one of the series and shunt acoustic wave resonators. The active adjustment circuit outputs an active thermal compensation signal correlated to a thermal variation sensed by the thermal sensing acoustic wave resonator to the variable capacitance device. The active thermal compensation signal induces a capacitance variation of the variable capacitance device such that the impact of the thermal variation to the acoustic wave device is compensated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.