Techniques for device attachment with dual band imaging sensor
US10757308B2 · kind B2 · utility
0Cited by
74References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Nov 4, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/0077
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. The device attachment may include an infrared imagining module and a non-thermal imaging module that cooperate with one or more of a non-thermal imaging module in an attached device and a light source in the attached device for capturing and processing images.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.