Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor
US10757821B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2019 |
| Grant date | Aug 25, 2020 |
| Priority date | — |
| Expiry date | Apr 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1423
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.