Bondable microcapsules and surface functionalized fillers
US10758458B2 · kind B2 · utility
3Cited by
3References
14Claims
0Family size
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Key dates
| Filing date | Sep 24, 2015 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Sep 24, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/8175
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A composition comprising microcapsules functionalized with polymerizable functional groups on the surface of said microcapsules wherein the functional groups form covalent bonds with monomers in the continuous phase to enhance the mechanical properties of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.