Mold surface treatment method and mold treated with said method
US10758968B2 · kind B2 · utility
2Cited by
3References
4Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 11, 2015 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | May 19, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/3842
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of treating a surface of a mold. The method includes forming dimples on a surface of a mold by ejecting substantially spherical ejection-particles so as to bombard the surface of the mold. The dimples are formed so as to satisfy a condition defined by the following formula: 1+3.3e−H/230≤W≤3+13.4e−H/1060 wherein W is an equivalent diameter (μm) of the dimples and H is a base metal hardness (Hv) of the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.