Method for three-dimensionally shaping resin packaging member, and resin packaging member
US10759134B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Dec 8, 2016 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Mar 4, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D75/5866
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A method for three-dimensionally forming a resin packaging member. The resin packaging member is heated to a temperature not higher than the Vicat softening temperature of the packaging member, and then compression shaping is conducted at a temperature not lower than room temperature and not higher than the Vicat softening temperature so as to form a three-dimensionally shaped portion with a large protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.