Multilayer pouch with heat-shrinkable layer

US10759578B2 · kind B2 · utility

Assignee

• Bemis Associates, Inc. · US

Inventors

• Peter M. Chen · Ann Arbor, US
• Xiangke Shi · Neenah, US
• Jay D. Hodson · Greenville, US
• Seamus A. Wedge · Neenah, US
• Curtis Randolph Barr · Neenah, US

Key dates

• Filing date: Feb 24, 2016
• Grant date: Sep 1, 2020
• Expiry date: Aug 5, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B65D75/008
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A multilayer pouch with heat-shrinkable layer is described. The pouch comprises a first wall; a second wall; a perimeter comprising a first edge and a second edge opposing the first edge; and a product space positioned between the first wall, the second wall, and the perimeter. The pouch is configured to fully enclose the product space. The first wall comprises a first wall first layer having a machine direction shrinkage value of greater than 5% shrink at 90° C., a first wall second layer having a machine direction Gurley stiffness force of at least 800 mgf and a machine direction shrinkage value at 90° C. of less than the machine direction shrinkage value of the first wall first layer at 90° C., a first wall pattern connection, and a first wall air inlet. The first wall first layer is interior the first wall second layer. Various embodiments of the pouch are also described.