Removable pressure-sensitive adhesive strip
US10759974B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Aug 26, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2453/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., and a softening point (ring & ball) of greater than or equal to 70° C., and the PSA compound has being foamed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.