Multi-camera processor with feature matching
US10762664B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Jun 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30244
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the two or more cameras, and perform a photometric calibration between the first camera and the second camera based on a portion of the first image corresponding to the detected feature and a portion of the second image corresponding to the matched feature. Other embodiments are disclosed and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.