Patent · US Active

Power semiconductor device comprising a housing, and method for producing a power semiconductor device

US10763182B2 · kind B2 · utility

4Cited by

0References

14Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Thomas Hunka · Nuremberg, DE
Stefan Weiss · Trostberg, DE
Rainer Popp · Petersaurach, DE

Key dates

Filing date	May 16, 2019
Grant date	Sep 1, 2020
Priority date	—
Expiry date	May 16, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01R43/005
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a power semiconductor device having a pin element which passes through a housing opening, an elastic sealing device which is arranged between a housing opening wall of the housing, where the housing opening wall delimits the housing opening and encircles the pin element. The pin element runs through the sleeve and through a sealing device opening of the sealing element. The sealing device is not connected in a materially bonded manner to the sleeve, to the housing opening wall and to the pin element and the sealing device seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element. A crosslinked potting compound is arranged on the sealing device. The crosslinked potting compound is connected in a materially bonded manner to the sleeve, to the housing opening wall and to the pin element and the potting compound seals off the housing opening wall from the sleeve and seals off the sleeve from the pin element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.