Dual in-line memory module (DIMM) Edgewater Spring (EWS) multi point contact cooling jacket
US10763191B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Jun 11, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2280/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Systems and apparatus are provided for thermal cooling of integrated circuits, such as dual in-line memory modules (DIMMs). The apparatus includes a plurality of rows pieces that include individual leaf springs. Each of the leaf springs can exert compression to support thermal contact and a stable coupling with a received DIMM. The plurality of row pieces can be assembled to form a single structure, having a space to receive an individual DIMM for insertion. Further, each of the leaf springs are structured to allow a portion of its surface, having a conductive material disposed thereon, to support transfer of heat away from the DIMM at a point of thermal contact. The apparatus can be coupled to a printed circuit assembly (PCA) having additional cooling mechanisms installed thereon, in a manner that allows the additional cooling mechanisms to be integrated with the apparatus and provide increased thermal cooling for the DIMMs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.