Semiconductor package and antenna module including the same
US10763217B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/2283
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and an antenna module including the same includes a frame having first and second through-holes, a semiconductor chip disposed in the first through-hole of the frame and having an active surface on which a connection pad is disposed and an inactive surface disposed on an opposite side of the active surface, a wiring chip disposed in the second through-hole of the frame and including a body portion and a plurality of through vias penetrating the body portion, an encapsulant encapsulating at least portions of the semiconductor chip and the wiring chip, and a connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and the through via of the wiring chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.