Systems and methods of operating wire bonding machines including clamping systems
US10763236B2 · kind B2 · utility
0Cited by
13References
15Claims
0Family size
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Key dates
| Filing date | Jan 9, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Jan 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/85205
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.