Method of aligning semiconductor chips, method of arranging semiconductor chips, device that produces a semiconductor component, and semiconductor component

US10763238B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Philipp Kreuter · Teublitz, DE
• Andreas Biebersdorf · Regensburg, DE
• Christoph Klemp · Regensburg, DE
• Jens Ebbecke · Rottenburg a. d. Laaber, DE
• Ines Pietzonka · Donaustauf, DE
• Petrus Sundgren · Lappersdorf, DE

Key dates

• Filing date: Aug 30, 2017
• Grant date: Sep 1, 2020
• Expiry date: Aug 30, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/01
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of aligning semiconductor chips in a medium includes providing an electrically insulating liquid medium; providing semiconductor chips; forming a suspension with the medium and the semiconductor chips; exposing the semiconductor chips to electromagnetic radiation that generates free charge carriers in the semiconductor chips; arranging the suspension in an electric field in which the semiconductor chips are aligned along the electric field; and curing the medium after aligning the semiconductor chips.