Optoelectronic component with a first potting material covering parts of a first optoelectronic semiconductor chip and a second potting material covering the first potting material
US10763245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/852
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a carrier, wherein a first optoelectronic semiconductor chip and a second optoelectronic semiconductor chip are arranged above a top side of the carrier, the optoelectronic semiconductor chips each include a top side, an underside situated opposite the top side, and side faces extending between the top side and the underside, the undersides of the optoelectronic semiconductor chips face the top side of the carrier, a first potting material is arranged above the top side of the carrier, the first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, and a second potting material is arranged above the top side of the carrier, and the second potting material covering the first potting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.