Driving substrate
US10763308B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2018 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Oct 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A driving substrate includes a substrate, a plurality of active devices, a thermal-conducting pattern layer and a buffer layer. The active devices are separately arranged on the substrate. Each active device includes a gate, a channel layer, a gate insulation layer, a source and a drain. The source and the drain expose a portion of the channel layer to define a channel region. The thermal-conducting pattern layer is disposed on the substrate and includes at least one thermal-conducting body and at least one thermal-conducting pattern connected to the thermal-conducting body. The thermal-conducting pattern corresponds to a location of at least one of the channel region, the channel layer, the gate, the source and the drain and each active device. The buffer layer is disposed on the substrate and covers the thermal-conducting pattern layer, and is located between the thermal-conducting pattern and each active device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.