Patent · US Active

Method for forming an electrical interconnect

US10763376B1 · kind B1 · utility

0Cited by

33References

20Claims

0Family size

Assignee

The Boeing Company · US

Inventors

John S. Frost · Thousand Oaks, US
Randolph J. Brandt · Palmdale, US
Peter Hebert · Glendale, US
Omar Al Taher · Los Angeles, US

Key dates

Filing date	Sep 2, 2015
Grant date	Sep 1, 2020
Priority date	—
Expiry date	Jul 27, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02E10/50
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A method including forming an interconnect in a metal member. The interconnect includes multiple repeating, nested V-shaped structures forming a continuous central portion. A vertex of each of the multiple repeating, nested V-shaped structures adjoins a next vertex of a next V-shaped structure of the multiple repeating, nested V-shaped structures. The method further includes separating the interconnect from the metal member.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.