Light emitting device package
US10763398B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2019 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Jan 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8515
Abstract
A light emitting device package according to an embodiment includes: a body including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface, and first and second openings passing through the upper surface and the lower surface; and a light emitting device including first and second bonding portions disposed on the first and second openings, respectively, wherein the body may include a recess provided on the lower surface, the recess may be vertically overlapped with the first opening and the second opening, and the recess may be exposed at the side surface of the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.