Thermal block assembly, LED arrangement with the same, and method of manufacturing said thermal assembly
US10763417B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2017 |
| Grant date | Sep 1, 2020 |
| Priority date | — |
| Expiry date | Apr 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0365
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention describes a thermal block assembly comprising a first thermally and electrically conductive block part realised for connection to an anode pad of a light-emitting diode (LED) and dimensioned to provide an essentially complete thermal path for heat originating at the anode pad; a second thermally and electrically conductive block part realised for connection to a cathode pad of the LED and dimensioned to provide an essentially complete thermal path for heat originating at the cathode pad; and a bonding layer applied to the block parts to fix the positions of the block parts on either side of a gap. The invention further describes an LED arrangement comprising said thermal block assembly and at least one LED mounted thereto, and a method of manufacturing said thermal block assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.