Systems and methods for manufacturing header subassembly
US10765874B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Nov 15, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/753
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.