Edge polishing a glass substrate after cutting
US10766805B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2017 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Aug 3, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method includes projecting energy onto an annular edge of a glass substrate. The annular edge includes a first roughness. The first roughness is reduced to a second roughness with the energy. The energy reduces the first roughness without changing a roundness of the annular edge of the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.