Resin composition, method for producing resin composition, film formation method, and cured product
US10767017B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Sep 8, 2020 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.